交付内容
- InAs and InGaAs device wafers
- Photodetector and sensor structures
- Custom mesa, passivation and contact processes
- Test chips and engineering wafers
- Diced components and full-wafer delivery
- Pilot and recurring production support
Custom development · Engineering wafers · Dedicated production
InAs / InGaAs平台
Custom InAs and InGaAs device platforms for photodetectors, infrared sensing, high-speed electronics and heterogeneous integration.
面向红外探测、传感与集成光电子的先进III-V平台。
Infrared-sensitive material platforms
Custom III–V process integration
Detector and sensing architectures
Diced chip and wafer-level delivery
可配置参数
- Epitaxial structure
- Wavelength or sensing target
- Device geometry
- Passivation and contact stack
- Wafer dimensions
- Prototype and annual quantity
应用领域
- Infrared detection
- Gas and chemical sensing
- Scientific instrumentation
- Quantum and cryogenic devices
- High-speed optoelectronics
- Integrated sensing systems
制造路线
1
工程样品
2
试产
3
量产
真实制造与表征
精选25FAB及项目相关的真实制造与表征图片，以更适合客户理解和判断的方式呈现。
