交付内容
- SiC wafers and device structures
- Custom etch and metallisation processes
- MEMS and photonic structures
- Diced chips and full-wafer delivery
- Engineering wafers and pilot lots
- Metrology and inspection options
Custom wafer development · Dedicated runs · Scale-up
SiC平台
Custom silicon-carbide device and process platforms for photonics, MEMS, sensing, power electronics and demanding operating environments.
面向高功率、恶劣环境及先进传感的坚固平台。
Harsh-environment capability
High thermal and mechanical stability
Custom wafer and device processing
Engineering samples to repeat production
可配置参数
- SiC polytype and wafer type
- Device-layer thickness
- Critical dimensions
- Etch depth and profile
- Metallisation and contacts
- Wafer size and quantity
应用领域
- Power and RF devices
- Harsh-environment sensors
- High-temperature MEMS
- Photonics and quantum devices
- Industrial inspection
- Advanced research platforms
制造路线
1
工程样品
2
试产
3
量产
真实制造与表征
精选25FAB及项目相关的真实制造与表征图片，以更适合客户理解和判断的方式呈现。
