压电MEMS麦克风与扬声器

交付内容

• Single microphone and speaker chips
• Dual-frequency and multi-band structures
• Microphone arrays and acoustic sensing chips
• Wafer-level devices and diced components
• Engineering samples and pilot lots
• Custom test structures and characterisation options

可配置参数

• Frequency response
• Sensitivity and dynamic-range targets
• Device and cantilever geometry
• Array size and pitch
• Electrical interface
• Packaging and environmental constraints

应用领域

• Aeroacoustic and wind-tunnel testing
• Industrial noise and condition monitoring
• Wearable and compact acoustic systems
• Ultrasonic transmission and reception
• Research instrumentation
• Custom OEM modules

制造路线