压电MEMS微镜

交付内容

• Single-axis and two-axis mirror chips
• Custom mirror apertures and suspension designs
• Wafer-level devices and diced chips
• Electrical test structures
• Engineering samples and dedicated wafer runs
• Project-specific scale-up

可配置参数

• Mirror aperture
• Mechanical scan angle
• Resonant or quasi-static operation
• Drive-voltage target
• Optical flatness requirements
• Packaging and system interface

应用领域

• AR/XR displays
• Solid-state LiDAR
• Pico-projection
• Optical switching
• Spectroscopy
• Industrial optical systems

制造路线