交付内容
- InP photonic and optoelectronic chips
- Custom process modules
- Active and passive device integration
- Diced chips and wafer-level delivery
- Test structures and process monitors
- Dedicated development and pilot runs
Engineering development · Dedicated wafer runs · Hybrid integration
InP平台
Custom indium-phosphide fabrication and integration for photonic integrated circuits, lasers, modulators, detectors and heterogeneous systems.
面向通信、传感与集成光源的高速光子与光电平台。
Active photonic devices
High-speed optoelectronics
Custom wafer-level processing
Hybrid integration routes
可配置参数
- Epitaxial stack
- Device architecture
- Waveguide and active-region geometry
- Metallisation and contacts
- Facet and chip requirements
- Wafer and production volume
应用领域
- Optical communications
- Integrated lasers
- Quantum photonics
- LiDAR and sensing
- Microwave photonics
- Heterogeneous PIC systems
制造路线
1
工程样品
2
试产
3
量产
真实制造与表征
精选25FAB及项目相关的真实制造与表征图片，以更适合客户理解和判断的方式呈现。
