Unser Lieferumfang
- SiC wafers and device structures
- Custom etch and metallisation processes
- MEMS and photonic structures
- Diced chips and full-wafer delivery
- Engineering wafers and pilot lots
- Metrology and inspection options
Custom wafer development · Dedicated runs · Scale-up
SiC-Plattformen
Custom silicon-carbide device and process platforms for photonics, MEMS, sensing, power electronics and demanding operating environments.
Robuste Halbleiter- und MEMS-Plattformen für hohe Leistung und raue Umgebungen.
Harsh-environment capability
High thermal and mechanical stability
Custom wafer and device processing
Engineering samples to repeat production
Konfigurierbare Parameter
- SiC polytype and wafer type
- Device-layer thickness
- Critical dimensions
- Etch depth and profile
- Metallisation and contacts
- Wafer size and quantity
Anwendungsbereiche
- Power and RF devices
- Harsh-environment sensors
- High-temperature MEMS
- Photonics and quantum devices
- Industrial inspection
- Advanced research platforms
Fertigungsweg
1
Engineering-Samples
2
Pilotproduktion
3
Serienproduktion
Reale Fertigung & Charakterisierung
Ausgewählte 25FAB- und projektbezogene Fertigungsbilder mit stärkerer kommerzieller Präsentation.
Kontakt
SiC-Plattformen