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SPECIALIST TECHNOLOGY PORTFOLIO

Kernplatforms

Kies een device- of materiaalplatform. 25FAB ondersteunt AI-ontwerp, procesintegratie, engineering wafers, dedicated runs en industriële opschaling.

PMUT Custom Platforms
ENGINEERING · PILOT · VOLUME

PMUT Custom Platforms

Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.

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Piëzo-MEMS microfoons & speakers
ENGINEERING · PILOT · VOLUME

Piëzo-MEMS microfoons & speakers

Clear sound, wide bandwidth and compact piezoelectric acoustic devices.

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Piëzo-MEMS micromirrors
ENGINEERING · PILOT · VOLUME

Piëzo-MEMS micromirrors

Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.

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SiC-platforms
ENGINEERING · PILOT · VOLUME

SiC-platforms

Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.

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InP-platforms
ENGINEERING · PILOT · VOLUME

InP-platforms

High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.

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InAs / InGaAs-platforms
ENGINEERING · PILOT · VOLUME

InAs / InGaAs-platforms

Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.

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PIC-platforms
ENGINEERING · PILOT · VOLUME

PIC-platforms

Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.

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PIC + piëzo / BTO-integratie
ENGINEERING · PILOT · VOLUME

PIC + piëzo / BTO-integratie

PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.

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Metasurface & metalens-platforms
ENGINEERING · PILOT · VOLUME

Metasurface & metalens-platforms

Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.

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GaN, GaAs, GeSn, diamant & advanced custom platforms
ENGINEERING · PILOT · VOLUME

GaN, GaAs, GeSn, diamant & advanced custom platforms

Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.

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Materialen & wafer foundry

Eén route voor multi-materiaal fabricage

25FAB ondersteunt projectspecifiek ontwerp en waferprocessing voor piëzo, fotonica, III–V, wide-bandgap en heterogene materiaalsystemen.

Standaard / gevestigde routes

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Standaard / gevestigde routes

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Standaard / gevestigde routes

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Standaard / gevestigde routes

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Standaard / gevestigde routes

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Projectspecifieke haalbaarheid

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization

Contact

Van AI-ondersteund device-ontwerp tot waferfabricage voor piëzo-MEMS, fotonica, III–V, wide-bandgap en heterogene materiaalsystemen.

25FAB AI-ONDERSTEUNDE ENGINEERING

Tell 25FAB what you need

Submit a technically actionable design brief. Nothing is stored on this website: the final button prepares an email in your own email application.

Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

BETALING → DESIGN
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