AI Design Specificaties indienen
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FROM ENGINEERING TO PRODUCTION

Foundry-diensten

Van AI-ondersteund device-ontwerp tot waferfabricage voor piëzo-MEMS, fotonica, III–V, wide-bandgap en heterogene materiaalsystemen.

1

Maatwerkontwikkeling

From specification and feasibility review to a manufacturable design.

2

Engineering samples

Rapid prototypes and engineering wafers for validation.

3

Procesintegratie

Advanced MEMS, photonics and piezoelectric process integration.

4

MPW / Dedicated runs

Flexible shared-wafer and customer-dedicated manufacturing.

5

Volumeproductie

Repeatable wafer-level manufacturing with controlled quality.

SEM process characterization
Microfabrication detail
Packaged functional module
Functional microdevice in hand
Materialen & wafer foundry

Eén route voor multi-materiaal fabricage

25FAB ondersteunt projectspecifiek ontwerp en waferprocessing voor piëzo, fotonica, III–V, wide-bandgap en heterogene materiaalsystemen.

Standaard / gevestigde routes

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Standaard / gevestigde routes

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Standaard / gevestigde routes

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Standaard / gevestigde routes

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Standaard / gevestigde routes

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Projectspecifieke haalbaarheid

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization
25FAB AI-ONDERSTEUNDE ENGINEERING

Tell 25FAB what you need

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Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

BETALING → DESIGN
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