Reka Bentuk AI Hantar keperluan
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SPECIALIST TECHNOLOGY PORTFOLIO

Platform teknologi teras

Pilih platform peranti atau bahan. 25FAB menyokong reka bentuk AI, integrasi proses, wafer kejuruteraan, dedicated runs dan peningkatan skala industri.

Platform PMUT Tersuai
ENGINEERING · PILOT · VOLUME

Platform PMUT Tersuai

Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.

Lihat platform →
Mikrofon & Speaker MEMS Piezoelektrik
ENGINEERING · PILOT · VOLUME

Mikrofon & Speaker MEMS Piezoelektrik

Clear sound, wide bandwidth and compact piezoelectric acoustic devices.

Lihat platform →
Micromirror MEMS Piezoelektrik
ENGINEERING · PILOT · VOLUME

Micromirror MEMS Piezoelektrik

Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.

Lihat platform →
Platform SiC
ENGINEERING · PILOT · VOLUME

Platform SiC

Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.

Lihat platform →
Platform InP
ENGINEERING · PILOT · VOLUME

Platform InP

High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.

Lihat platform →
Platform InAs / InGaAs
ENGINEERING · PILOT · VOLUME

Platform InAs / InGaAs

Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.

Lihat platform →
Platform PIC
ENGINEERING · PILOT · VOLUME

Platform PIC

Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.

Lihat platform →
Integrasi PIC + Piezo / BTO
ENGINEERING · PILOT · VOLUME

Integrasi PIC + Piezo / BTO

PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.

Lihat platform →
Platform Metasurface & Metalens
ENGINEERING · PILOT · VOLUME

Platform Metasurface & Metalens

Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.

Lihat platform →
GaN, GaAs, GeSn, Diamond & Platform Tersuai Lanjutan
ENGINEERING · PILOT · VOLUME

GaN, GaAs, GeSn, Diamond & Platform Tersuai Lanjutan

Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.

Lihat platform →
Bahan & wafer foundry

Satu laluan pembuatan berbilang bahan

25FAB menyokong reka bentuk dan pemprosesan wafer mengikut projek untuk sistem piezoelektrik, fotonik, III–V, wide-bandgap dan heterogen.

Laluan standard / mantap

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Laluan standard / mantap

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Laluan standard / mantap

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Laluan standard / mantap

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Laluan standard / mantap

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Semakan kebolehlaksanaan projek

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization

Hubungi

Daripada reka bentuk peranti berbantu AI kepada pembuatan tahap wafer untuk MEMS piezoelektrik, fotonik, III–V, wide-bandgap dan sistem bahan heterogen.

25FAB KEJURUTERAAN BERBANTUKAN AI

Tell 25FAB what you need

Submit a technically actionable design brief. Nothing is stored on this website: the final button prepares an email in your own email application.

Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

BAYARAN → REKA BENTUK
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