AI Design Submit Requirements
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SPECIALIST TECHNOLOGY PORTFOLIO

Core Technology Platforms

Choose a device or material platform. 25FAB supports AI-assisted design, process integration, engineering wafers, dedicated runs and industrial scale-up.

PMUT Custom Platforms
ENGINEERING · PILOT · VOLUME

PMUT Custom Platforms

Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.

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Piezoelectric MEMS Microphones & Speakers
ENGINEERING · PILOT · VOLUME

Piezoelectric MEMS Microphones & Speakers

Clear sound, wide bandwidth and compact piezoelectric acoustic devices.

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Piezoelectric MEMS Micromirrors
ENGINEERING · PILOT · VOLUME

Piezoelectric MEMS Micromirrors

Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.

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SiC Platforms
ENGINEERING · PILOT · VOLUME

SiC Platforms

Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.

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InP Platforms
ENGINEERING · PILOT · VOLUME

InP Platforms

High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.

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InAs / InGaAs Platforms
ENGINEERING · PILOT · VOLUME

InAs / InGaAs Platforms

Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.

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PIC Platforms
ENGINEERING · PILOT · VOLUME

PIC Platforms

Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.

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PIC + Piezo / BTO Integration
ENGINEERING · PILOT · VOLUME

PIC + Piezo / BTO Integration

PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.

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Metasurface & Metalens Platforms
ENGINEERING · PILOT · VOLUME

Metasurface & Metalens Platforms

Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.

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GaN, GaAs, GeSn, Diamond & Advanced Custom Platforms
ENGINEERING · PILOT · VOLUME

GaN, GaAs, GeSn, Diamond & Advanced Custom Platforms

Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.

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Materials & wafer foundry

One multi-material manufacturing route

25FAB supports project-specific design and wafer processing across piezoelectric, photonic, III–V, wide-bandgap and heterogeneous material systems.

Standard / established routes

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Standard / established routes

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Standard / established routes

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Standard / established routes

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Standard / established routes

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Project-specific feasibility route

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization

Contact

Swiss engineering from AI-assisted device design to wafer-level manufacturing across piezoelectric MEMS, photonics, III–V, wide-bandgap and heterogeneous material systems.

25FAB AI-ASSISTED ENGINEERING

Tell 25FAB what you need

Submit a technically actionable design brief. Nothing is stored on this website: the final button prepares an email in your own email application.

Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

PAYMENT → DESIGN
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01Design brief
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02Requested deliverables
03Company / Institution
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