Reka Bentuk AI Hantar keperluan
MS
FROM ENGINEERING TO PRODUCTION

Perkhidmatan foundry

Daripada reka bentuk peranti berbantu AI kepada pembuatan tahap wafer untuk MEMS piezoelektrik, fotonik, III–V, wide-bandgap dan sistem bahan heterogen.

1

Pembangunan tersuai

From specification and feasibility review to a manufacturable design.

2

Sampel kejuruteraan

Rapid prototypes and engineering wafers for validation.

3

Integrasi proses

Advanced MEMS, photonics and piezoelectric process integration.

4

MPW / Dedicated runs

Flexible shared-wafer and customer-dedicated manufacturing.

5

Pengeluaran volum

Repeatable wafer-level manufacturing with controlled quality.

SEM process characterization
Microfabrication detail
Packaged functional module
Functional microdevice in hand
Bahan & wafer foundry

Satu laluan pembuatan berbilang bahan

25FAB menyokong reka bentuk dan pemprosesan wafer mengikut projek untuk sistem piezoelektrik, fotonik, III–V, wide-bandgap dan heterogen.

Laluan standard / mantap

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Laluan standard / mantap

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Laluan standard / mantap

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Laluan standard / mantap

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Laluan standard / mantap

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Semakan kebolehlaksanaan projek

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization
25FAB KEJURUTERAAN BERBANTUKAN AI

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Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

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