PMUT · 126% MEASURED BANDWIDTH
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
Explore module →
SWISS AI DESIGN · INTEGRASI MONOLITIK BERBILANG BAHAN · PENGELUARAN VOLUM
Cip berbilang bahan direka AI. Disahkan melalui pengukuran dalam ~3 bulan. Sedia diskala.
25FAB mengoptimumkan bersama fizik peranti, geometri, bahan dan kekangan proses, mengintegrasikan bahan fungsi pada tahap wafer dan membawa program daripada seni bina AI kepada engineering wafer yang diukur, pilot dan pengeluaran berulang.
126%Bandwidth PMUT diukur
69 dBOutput akustik diukur
20 MHz/VDC tuning diukur
~3 monthsValidasi engineering pertama
AI co-design · integrasi berbilang bahan · wafer-level scale-up
PMUT · OEM MODULE
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
PIEZO-TUNABLE PIC · 20 MHz/V
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
PRODUCT MODULES · FIRST
Flagship product & system modules
Start with measured products. 25FAB puts PMUT, piezo-tunable PICs and the 69 dB piezo MEMS speaker first, with a dedicated module route for quantum systems.
PIEZO-TUNABLE PIC · 20 MHz/V MEASURED
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
Explore module →PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
Explore module →
QUANTUM SYSTEMS · FEATURED
Quantum Photonics & Beam Control
A modular wafer-level route for neutral-atom optical control, quantum photonics and precision beam systems: piezo MEMS, metasurfaces and tunable PICs.
Explore quantum systems →DIUKUR · BUKAN SIMULASI SAHAJA
Mulakan program pengeluaranPrestasi diukur. Laluan ke pengeluaran.
Bukan simulasi sahaja: AI design, wafer fabrication, measurement dan scale-up dalam satu gelung.
Platform ultrasound piezo broadband · custom, pilot, volume.
Speaker Piezo MEMS wafer-level · custom, pilot, volume.
PIC piezo-tunable sekitar 1550 nm · respons berulang pada +10 V / −10 V.
Program terpilih: design freeze → wafer → measurement → feedback.
DIUKUR · BUKAN SIMULASI SAHAJA
PMUT · 126%
Platform ultrasound piezo broadband · custom, pilot, volume.
PILOT + VOLUMEDIUKUR · BUKAN SIMULASI SAHAJA
Speaker · 69 dB
Speaker Piezo MEMS wafer-level · custom, pilot, volume.
PILOT + VOLUME
DIUKUR · BUKAN SIMULASI SAHAJA
Piezo-Tunable PIC · 20 MHz/V
PIC piezo-tunable sekitar 1550 nm · respons berulang pada +10 V / −10 V.
PILOT + VOLUMEMelangkaui MEMS: reka cip fungsi dengan 25FAB AI
Hantar sasaran fungsi untuk MEMS, fotonik, metasurface, semikonduktor kompaun atau peranti tersuai untuk diterjemah kepada seni bina boleh dibuat dan laluan integrasi berbilang bahan.
≈3 minitke seni bina AI pertama
~3 monthsValidasi engineering pertama
Integrasi monolitik dan heterogen untuk sistem piezoelektrik, fotonik, III–V dan wide-bandgap.
Tentukan sasaran perantiBanding arah reka bentukSediakan brief boleh dibuat
Bayaran disahkan hari ini: pakej reka bentuk kejuruteraan profesional boleh dihantar pada hari yang sama apabila brief lengkap dan boleh dilaksanakan.
Satu laluan AI profesional untuk peranti fungsi melangkaui MEMS
PMUT large arrays32–1,024+ elements · imaging · ultra-low-powerMetasurface & metalensWavelength · NA · aperture · efficiency · wavefrontPiezoelectric micromirrors1D/2D scanning · low voltage · compact optical enginesPhotonic PICSi₃N₄ · SOI · heterogeneous integrationCustom multi-material devicesFunction · interfaces · performance · manufacturable route
Contoh inverse design berpandukan fizik
Bahan & wafer foundry
Satu laluan pembuatan berbilang bahan
25FAB menyokong reka bentuk dan pemprosesan wafer mengikut projek untuk sistem piezoelektrik, fotonik, III–V, wide-bandgap dan heterogen.
Laluan standard / mantap
Piezoelectric / electro-optic
Laluan standard / mantap
Photonics / silicon
Laluan standard / mantap
III–V semiconductors
Laluan standard / mantap
Wide-bandgap / advanced
Laluan standard / mantap
Heterogeneous integration
Semakan kebolehlaksanaan projek
Engineering feasibility
Platform teknologi
Pembangunan dan pembuatan untuk MEMS, fotonik, metasurface, semikonduktor kompaun dan peranti tersuai.
ENGINEERING · PILOT · VOLUME
Platform PMUT Tersuai
Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Mikrofon & Speaker MEMS Piezoelektrik
Clear sound, wide bandwidth and compact piezoelectric acoustic devices.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Micromirror MEMS Piezoelektrik
Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Platform SiC
Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Platform InP
High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Platform InAs / InGaAs
Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Platform PIC
Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Integrasi PIC + Piezo / BTO
PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.
Lihat platform →
ENGINEERING · PILOT · VOLUME
Platform Metasurface & Metalens
Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.
Lihat platform →
ENGINEERING · PILOT · VOLUME
GaN, GaAs, GeSn, Diamond & Platform Tersuai Lanjutan
Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.
Lihat platform →PILOT + VOLUME
Daripada reka bentuk custom kepada pengeluaran berulang
Semua platform disokong boleh bergerak daripada NRE dan engineering wafer ke pilot, qualification dan pengeluaran berulang.
AI design → integrasi multi-material → engineering wafer → measurement → pilot → volume
AI DESIGN + DFM
Engineering wafer
Measured validation
Pilot + qualification
Recurring wafer supply
Volume manufacturing
Custom NRE → Production
Daripada keperluan kepada pembuatan
Fasa projek yang jelas untuk OEM, pasukan penyelidikan dan syarikat deep-tech.
Define
Target function, frequency, aperture, geometry, interfaces and delivery format.
Engineer
Device architecture and process route are aligned with the target application.
Prototype
Engineering samples or wafers provide the first physical validation point.
Scale
Pilot and dedicated wafer routes support the transition toward repeatable supply.
Bincang projek
AI co-design, integrasi monolitik berbilang bahan, prestasi diukur dan laluan daripada engineering wafer ke pilot dan pengeluaran volume.