AI Design Submit Requirements
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FROM ENGINEERING TO PRODUCTION

Foundry Services

Swiss engineering from AI-assisted device design to wafer-level manufacturing across piezoelectric MEMS, photonics, III–V, wide-bandgap and heterogeneous material systems.

1

Custom Development

From specification and feasibility review to a manufacturable design.

2

Engineering Samples

Rapid prototypes and engineering wafers for validation.

3

Process Integration

Advanced MEMS, photonics and piezoelectric process integration.

4

MPW / Dedicated Runs

Flexible shared-wafer and customer-dedicated manufacturing.

5

Volume Production

Repeatable wafer-level manufacturing with controlled quality.

SEM process characterization
Microfabrication detail
Packaged functional module
Functional microdevice in hand
Materials & wafer foundry

One multi-material manufacturing route

25FAB supports project-specific design and wafer processing across piezoelectric, photonic, III–V, wide-bandgap and heterogeneous material systems.

Standard / established routes

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
Standard / established routes

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
Standard / established routes

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
Standard / established routes

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
Standard / established routes

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
Project-specific feasibility route

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization
25FAB AI-ASSISTED ENGINEERING

Tell 25FAB what you need

Submit a technically actionable design brief. Nothing is stored on this website: the final button prepares an email in your own email application.

Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

PAYMENT → DESIGN
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01Design brief
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02Requested deliverables
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