1
客製開發
From specification and feasibility review to a manufacturable design.
FROM ENGINEERING TO PRODUCTION
晶圓代工
從 AI 輔助器件設計到晶圓級製造，涵蓋壓電 MEMS、光子、III–V、寬能隙與異質材料系統。
2
工程樣品
Rapid prototypes and engineering wafers for validation.
3
製程整合
Advanced MEMS, photonics and piezoelectric process integration.
4
MPW / 專用流片
Flexible shared-wafer and customer-dedicated manufacturing.
5
量產
Repeatable wafer-level manufacturing with controlled quality.
