What We Supply
- InP photonic and optoelectronic chips
- Custom process modules
- Active and passive device integration
- Diced chips and wafer-level delivery
- Test structures and process monitors
- Dedicated development and pilot runs
Engineering development · Dedicated wafer runs · Hybrid integration
InP Platforms
Custom indium-phosphide fabrication and integration for photonic integrated circuits, lasers, modulators, detectors and heterogeneous systems.
High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.
Active photonic devices
High-speed optoelectronics
Custom wafer-level processing
Hybrid integration routes
Configurable Parameters
- Epitaxial stack
- Device architecture
- Waveguide and active-region geometry
- Metallisation and contacts
- Facet and chip requirements
- Wafer and production volume
Application Areas
- Optical communications
- Integrated lasers
- Quantum photonics
- LiDAR and sensing
- Microwave photonics
- Heterogeneous PIC systems
Manufacturing Route
1
Engineering Samples
2
Pilot Production
3
Volume Production
Real Fabrication & Characterisation
Selected 25FAB and project fabrication images presented in a more commercial, customer-ready format.
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InP Platforms