PMUT-P15OEM CONFIGURATION
1–5 MHz
Phased / deep-acoustic window
Compact phased-array and deeper-penetration architectures for OEM systems requiring lower-frequency operation.
View RFQ →Industrial PMUT transducer platform
Industrial PMUT Chips & Arrays for OEM Ultrasound Systems
Wafer-level piezoelectric MEMS transducers engineered as semiconductor components for OEM products — from custom acoustic architecture and ASIC integration to pilot wafers and recurring supply.
126%measured bandwidth
7OEM frequency windows
32–1024+elements / custom arrays
200 mm8-inch scale-up route
Industrial reference frequency windows: 1–20 MHz
The portfolio is organized around common system-level frequency windows. Each PMUT is engineered to a target center frequency, bandwidth, array geometry and acoustic stack; the listed windows are configuration families, not a claim that one device is flat across the entire range.
OEM frequency architecture
Reference frequency windows aligned to real system classes
Choose the nearest operating window. The final device is engineered around your center frequency, bandwidth, aperture and electronics — not copied from a finished scanner.
PMUT-C26OEM CONFIGURATION
2–6 MHz
Convex / general imaging window
Curved or custom-aperture array programs for deeper field-of-view and general-purpose ultrasound architectures.
View RFQ →PMUT-M310OEM CONFIGURATION
3–10 MHz
Microconvex / endocavity window
Compact apertures for small-footprint probes, endocavity concepts and miniaturized OEM assemblies.
View RFQ →PMUT-L413OEM CONFIGURATION
4–13 MHz
Linear high-definition window
General linear-array platform for soft-tissue, vascular, procedural and industrial NDT-style architectures.
View RFQ →PMUT-L515OEM CONFIGURATION
5–15 MHz
High-frequency linear window
Higher-resolution linear arrays for shallow-to-mid-depth imaging and compact handheld platforms.
View RFQ →PMUT-U820OEM CONFIGURATION
8–20 MHz
Ultra-high-frequency linear window
Fine-pitch arrays for superficial high-resolution imaging, micro-imaging and ~20 MHz catheter / IVUS-oriented development.
View RFQ →PMUT-MP115OEM CONFIGURATION
1–15 MHz
Multi-band / multipurpose program
Custom mixed-aperture, multi-resonant or combined-array development when one OEM platform must address multiple operating windows.
View RFQ →The listed frequency ranges are OEM configuration windows. Final center frequency, bandwidth, sensitivity, output, impedance, pitch, aperture and system depth depend on the agreed PMUT design, packaging, electronics and acoustic stack.
Semiconductor component, industrial workflow
Built for OEM qualification and wafer-level supply
25FAB treats the PMUT as a semiconductor product: defined interfaces, wafer-level process control, characterization, packaging pathway and a production ramp plan.
What 25FAB supplies for an industrial program
Custom PMUT design and DFM
200 mm / 8-inch scale-up route
Engineering dies and wafer-level samples
Dedicated pilot and production wafers
Electrical and acoustic characterization plan
Wafer map / lot data as agreed
Diced die, full wafer or integration-ready formats
ASIC / interposer co-design pathway
Linear Arrays
32 to 1024+ elements; custom pitch, aperture and routing.
Phased Arrays
Compact electronically steered apertures for lower-frequency system architectures.
2D Matrix Arrays
Dense matrix architectures for volumetric imaging and research platforms, subject to design review.
Miniaturized / Catheter
Small-footprint arrays for IVUS-, ICE- and endoscopic-scale integration programs.
PMUT-on-ASIC / Interposer
Flip-chip, interposer, flex or wire-bond integration routes can be reviewed with the system electronics.
PMUT → SYSTEM
From PMUT membrane to OEM product
Clear ownership boundaries reduce integration risk.
PMUT device
Membrane stack · electrodes · element geometry · routing
Wafer / die interface
Pads · redistribution · interposer / flex · optional ASIC route
Electronics
Pulser · T/R switch · AFE · ADC · ASIC / FPGA
OEM system
Beamforming · enclosure · acoustic stack · software · qualification
System integration reference
PMUT inside a compact wireless product architecture
25FAB supplies the transducer semiconductor and can support integration engineering. The finished system, software, clinical claims and regulatory clearance remain system-level responsibilities unless separately contracted.
What to send in the first RFQ
- Target frequency window + center frequency
- -6 dB bandwidth target
- Array type + element count
- Pitch / aperture / die envelope
- Interface: wire-bond, flex, flip-chip or interposer
- AFE / ASIC constraints
- Prototype quantity + annual volume
- Target qualification and production date
WAFER · DEVICE · INTEGRATION
From microfabrication to product integration
Representative 25FAB project visuals spanning wafer-level structures, characterization, flexible arrays and compact product integration.
Industrial production route
Engineering → pilot → recurring supply
A procurement-friendly path from first wafer to production planning.
Requirements freeze
Frequency window, bandwidth, array, interface, packaging envelope and annual-volume target.
Engineering build
Design, DFM, process split and first electrical / acoustic characterization.
Pilot & qualification
Dedicated wafer lot, system integration, agreed test coverage and design freeze.
Recurring supply
Lot planning, agreed test data, delivery format and production cadence.
Start an industrial PMUT program
Send the target frequency window, center frequency, bandwidth, array type, element count, pitch / aperture, die envelope, interface / ASIC concept, prototype quantity, annual volume and target qualification date.