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Custom co-development · Dedicated integration · 8-inch-compatible route

PIC + Piezo / BTO Integration

Integrated photonic circuits combined with piezoelectric actuators and BTO-based functional materials for tunable photonics, electro-optic modulation, precision phase control and heterogeneous integration.

Integrated photonics combined with piezoelectric and BTO-based functional materials for tunable optical devices, high-speed modulation and heterogeneous integration.

Photonic, piezoelectric and BTO integration
Tunable optical and electro-optic devices
Multi-material process integration
Wafer-scale manufacturing pathway
PIC + Piezo / BTO Integration

What We Supply

  • PIC wafers with integrated piezoelectric and BTO devices
  • Tunable resonators, phase shifters and modulators
  • Custom bonding and integration flows
  • Electrical and optical test structures
  • Diced chips and full wafers
  • Engineering samples to pilot production

Configurable Parameters

  • Photonic platform
  • Piezoelectric or BTO device function
  • Tuning or modulation target
  • Drive and interface requirements
  • Integration sequence
  • Wafer and volume targets

Application Areas

  • Tunable photonics
  • Electro-optic modulation
  • Quantum systems
  • Optical communications
  • LiDAR and phased arrays
  • Precision sensing

Manufacturing Route

1

Engineering Samples

2

Pilot Production

3

Volume Production

Real Fabrication & Characterisation

Selected 25FAB and project fabrication images presented in a more commercial, customer-ready format.

Integrated wafer platform
Integrated wafer platform
Piezoelectric wafer-level devices
Piezoelectric wafer-level devices
Heterogeneous integration example
Heterogeneous integration example

Selected Publications

Representative publications related to this platform.

On-chip photoacoustic transducer based on monolithic integration of piezoelectric micromachined ultrasonic transducers and metasurface lenses
SPIE 2023 Oral presentation
Authors
Yanfen Zhai, Lixiang Wu
Journal / Conference
SPIE
Year
2023
Type
Oral presentation
On-chip integrated lateral and vertical tunable metasurfaces for 3D imaging
MNE-ES 2022 Oral presentation
Authors
Yanfen Zhai, Takashi Sasaki, Mohssen Moridi, Ronghui Lin, Zahrah Alnakhli, Lixiang Wu, Atif Shamim, Xiaohang Li, Mohammad Younis, Kazuhiro Hane
Journal / Conference
MNE-ES
Year
2022
Type
Oral presentation

Contact

PIC + Piezo / BTO Integration

office@25fab.ch