AI 설계 요구사항 제출
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FROM ENGINEERING TO PRODUCTION

파운드리 서비스

AI 기반 소자 설계부터 웨이퍼급 제조까지: 압전 MEMS, 포토닉스, III–V, 와이드밴드갭 및 이종 소재 시스템.

1

맞춤 개발

From specification and feasibility review to a manufacturable design.

2

엔지니어링 샘플

Rapid prototypes and engineering wafers for validation.

3

공정 통합

Advanced MEMS, photonics and piezoelectric process integration.

4

MPW / 전용 런

Flexible shared-wafer and customer-dedicated manufacturing.

5

양산

Repeatable wafer-level manufacturing with controlled quality.

SEM process characterization
Microfabrication detail
Packaged functional module
Functional microdevice in hand
소재 & 웨이퍼 파운드리

하나의 다중소재 제조 경로

25FAB은 압전, 포토닉, III–V, 와이드밴드갭 및 이종 소재 시스템의 맞춤 설계와 웨이퍼 공정을 지원합니다.

표준 / 구축된 경로

Piezoelectric / electro-optic

PZTAlNAlScN (≤40% Sc)BTO-on-Si
표준 / 구축된 경로

Photonics / silicon

Si₃N₄SOIGe-on-SiGeSn
표준 / 구축된 경로

III–V semiconductors

GaAsInPInAsInGaAsGaN / AlGaN/GaN
표준 / 구축된 경로

Wide-bandgap / advanced

SiCDiamondGaN-on-SiGaN-on-sapphire
표준 / 구축된 경로

Heterogeneous integration

PIC + PiezoPIC + BTOPMUT-on-ASIC / interposerIII–V-on-photonics
프로젝트별 타당성 검토

Engineering feasibility

non-standard bonded stackscustomer-supplied epi / wafersproject-specific materialscustom substrate stacks
SiCOI wafer
Piezoelectric speaker wafer
SEM process detail
Packaged semiconductor module
SEM process characterization
25FAB AI 지원 엔지니어링

Tell 25FAB what you need

Submit a technically actionable design brief. Nothing is stored on this website: the final button prepares an email in your own email application.

Same-day paid design package

A design package can be delivered on the day payment is confirmed, once the technical brief is complete and actionable. Fabrication, qualification and custom process development follow separate schedules.

결제 → 설계
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