Unser Lieferumfang
- InP photonic and optoelectronic chips
- Custom process modules
- Active and passive device integration
- Diced chips and wafer-level delivery
- Test structures and process monitors
- Dedicated development and pilot runs
Engineering development · Dedicated wafer runs · Hybrid integration
InP-Plattformen
Custom indium-phosphide fabrication and integration for photonic integrated circuits, lasers, modulators, detectors and heterogeneous systems.
Hochgeschwindigkeits-Photonik und Optoelektronik für Kommunikation und Sensorik.
Active photonic devices
High-speed optoelectronics
Custom wafer-level processing
Hybrid integration routes
Konfigurierbare Parameter
- Epitaxial stack
- Device architecture
- Waveguide and active-region geometry
- Metallisation and contacts
- Facet and chip requirements
- Wafer and production volume
Anwendungsbereiche
- Optical communications
- Integrated lasers
- Quantum photonics
- LiDAR and sensing
- Microwave photonics
- Heterogeneous PIC systems
Fertigungsweg
1
Engineering-Samples
2
Pilotproduktion
3
Serienproduktion
Reale Fertigung & Charakterisierung
Ausgewählte 25FAB- und projektbezogene Fertigungsbilder mit stärkerer kommerzieller Präsentation.
Kontakt
InP-Plattformen