Piezoelektrische MEMS-Mikrofone & Lautsprecher

Unser Lieferumfang

• Single microphone and speaker chips
• Dual-frequency and multi-band structures
• Microphone arrays and acoustic sensing chips
• Wafer-level devices and diced components
• Engineering samples and pilot lots
• Custom test structures and characterisation options

Konfigurierbare Parameter

• Frequency response
• Sensitivity and dynamic-range targets
• Device and cantilever geometry
• Array size and pitch
• Electrical interface
• Packaging and environmental constraints

Anwendungsbereiche

• Aeroacoustic and wind-tunnel testing
• Industrial noise and condition monitoring
• Wearable and compact acoustic systems
• Ultrasonic transmission and reception
• Research instrumentation
• Custom OEM modules

Fertigungsweg