AI設計 要件を送信
JA
QUANTUM SYSTEMS

Quantum Photonics & Beam-Control Modules

Wafer-level building blocks for neutral-atom control, quantum photonics and precision optical systems — combining piezoelectric beam steering, metasurfaces and integrated photonics.

25FAB packaged photonic modulePiezoelectric MEMS micromirrorMetasurface nanostructure

From optical control chip to packaged quantum module

25FAB develops custom wafer-level architectures for optical addressing, beam steering and integrated photonic control. Engineering routes can combine piezoelectric MEMS, metasurfaces, Si₃N₄/SOI photonics, III–V integration and packaged optical interfaces.

Piezoelectric beam steering

Low-voltage MEMS micromirror and array architectures for fast optical addressing and compact beam-control engines.

Metasurface / metalens

Custom wavelength, aperture, NA and wavefront engineering for beam shaping, focusing and optical addressing.

Tunable photonics

High-Q photonic devices with integrated piezoelectric actuation; measured DC tuning of 20 MHz/V on the demonstrated PIC platform.

20 MHz/VMeasured piezo-tunable PIC DC tuning

High-Q telecom-band photonic resonances with repeatable optical response under ±10 V actuation on the demonstrated platform.

Measured high-Q resonancesMeasured plus and minus 10 volt response

A modular route for quantum hardware

Start from the function you need. 25FAB co-designs the optical, mechanical and material stack, then carries the program through engineering wafer, measurement, packaging and scale-up.

01System requirement
02AI + physics co-design
03Multi-material wafer integration
04Optical / electrical validation
05Packaged module
06Pilot & recurring supply
25FAB packaged optical module

Quantum-ready integration route

Combine beam steering, wavefront engineering, photonic routing and packaged optical interfaces around the system function.

  • Piezoelectric MEMS / MOEMS beam control
  • Metasurface & metalens wavefront engineering
  • Si₃N₄ / SOI photonics and tunable PICs
  • III–V-on-photonics feasibility routes
  • Custom die, wafer and packaged module programs
25FAB AI支援エンジニアリング

必要な機能を25FABにお知らせください

技術評価可能な要件を入力してください。このサイトには保存されず、最後にお使いのメールアプリで送信内容を作成します。

支払い確認当日の設計パッケージ

技術要件が完全で実行可能な場合、支払い確認当日に設計パッケージを納品できます。製造・評価・カスタムプロセス開発は別スケジュールです。

支払い → 設計
ファミリーを選択すると専門的な入力項目が表示されます。25FAB AI Designを開く ↗
01設計要件
必須項目です。
選択した設計ファミリーに応じて技術例が変わります。
02希望する納品物
03会社 / 研究機関
必須項目です。