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QUANTUM SYSTEMS

Quantum Photonics & Beam-Control Modules

Wafer-level building blocks for neutral-atom control, quantum photonics and precision optical systems — combining piezoelectric beam steering, metasurfaces and integrated photonics.

25FAB packaged photonic modulePiezoelectric MEMS micromirrorMetasurface nanostructure

From optical control chip to packaged quantum module

25FAB develops custom wafer-level architectures for optical addressing, beam steering and integrated photonic control. Engineering routes can combine piezoelectric MEMS, metasurfaces, Si₃N₄/SOI photonics, III–V integration and packaged optical interfaces.

Piezoelectric beam steering

Low-voltage MEMS micromirror and array architectures for fast optical addressing and compact beam-control engines.

Metasurface / metalens

Custom wavelength, aperture, NA and wavefront engineering for beam shaping, focusing and optical addressing.

Tunable photonics

High-Q photonic devices with integrated piezoelectric actuation; measured DC tuning of 20 MHz/V on the demonstrated PIC platform.

20 MHz/VMeasured piezo-tunable PIC DC tuning

High-Q telecom-band photonic resonances with repeatable optical response under ±10 V actuation on the demonstrated platform.

Measured high-Q resonancesMeasured plus and minus 10 volt response

A modular route for quantum hardware

Start from the function you need. 25FAB co-designs the optical, mechanical and material stack, then carries the program through engineering wafer, measurement, packaging and scale-up.

01System requirement
02AI + physics co-design
03Multi-material wafer integration
04Optical / electrical validation
05Packaged module
06Pilot & recurring supply
25FAB packaged optical module

Quantum-ready integration route

Combine beam steering, wavefront engineering, photonic routing and packaged optical interfaces around the system function.

  • Piezoelectric MEMS / MOEMS beam control
  • Metasurface & metalens wavefront engineering
  • Si₃N₄ / SOI photonics and tunable PICs
  • III–V-on-photonics feasibility routes
  • Custom die, wafer and packaged module programs
25FAB INGÉNIERIE ASSISTÉE PAR IA

Décrivez votre besoin à 25FAB

Soumettez un cahier des charges techniquement exploitable. Rien n’est stocké sur ce site ; le dernier bouton prépare un e-mail dans votre application.

Dossier de conception payé et livré le jour même

Après confirmation du paiement, le dossier peut être livré le jour même si le cahier des charges est complet et exploitable. La fabrication et la qualification suivent un calendrier distinct.

PAIEMENT → DESIGN
Sélectionnez une famille pour charger les questions techniques adaptées.Ouvrir l’espace 25FAB AI Design ↗
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02Livrables demandés
03Entreprise / institution
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