PMUT · 126% MEASURED BANDWIDTH
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
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瑞士 AI 設計 · 多材料單片整合 · 晶圓級量產
AI 設計多材料功能晶片：約 3 個月完成首輪實測驗證，並可直接走向量產。
25FAB 將器件物理、幾何結構、材料堆疊與製程限制一起進行 AI 協同最佳化，並在共同晶圓級平台整合多種功能材料；從 AI 架構、工程晶圓與實測回饋，到試產、qualification 與持續量產供貨。
126%PMUT 實測頻寬
69 dBSpeaker 實測聲學輸出
20 MHz/VPIC 實測 DC 調諧效率
~3 months首輪工程實測驗證
AI 協同設計 · 多材料單片/異質整合 · 晶圓級放大
PMUT · OEM MODULE
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
PIEZO-TUNABLE PIC · 20 MHz/V
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
PRODUCT MODULES · FIRST
Flagship product & system modules
Start with measured products. 25FAB puts PMUT, piezo-tunable PICs and the 69 dB piezo MEMS speaker first, with a dedicated module route for quantum systems.
PIEZO-TUNABLE PIC · 20 MHz/V MEASURED
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
Explore module →PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
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QUANTUM SYSTEMS · FEATURED
Quantum Photonics & Beam Control
A modular wafer-level route for neutral-atom optical control, quantum photonics and precision beam systems: piezo MEMS, metasurfaces and tunable PICs.
Explore quantum systems →實測 · 不只是模擬
啟動量產專案實測性能，而不只是模擬。
25FAB 將 AI 設計、晶圓製造、器件測試與量產放在同一閉環中。
寬頻壓電超音波平台 · 接受客製、試產與量產專案。
晶圓級壓電 MEMS Speaker · 接受客製、試產與量產。
約 1550 nm 壓電可調 PIC · +10 V / −10 V 下具有可重複光學響應。
部分專案：設計凍結 → 晶圓製造 → 測試 → 設計回饋約 3 個月。
實測 · 不只是模擬
PMUT · 126%
寬頻壓電超音波平台 · 接受客製、試產與量產專案。
接受試產 + 量產實測 · 不只是模擬
Speaker · 69 dB
晶圓級壓電 MEMS Speaker · 接受客製、試產與量產。
接受試產 + 量產
實測 · 不只是模擬
Piezo-Tunable PIC · 20 MHz/V
約 1550 nm 壓電可調 PIC · +10 V / −10 V 下具有可重複光學響應。
接受試產 + 量產不只 MEMS：使用 25FAB AI 設計各類功能晶片
提交 MEMS、光子、超表面、化合物半導體或客製器件的功能目標，轉換為可製造架構與多材料整合路線。
約 3 分鐘生成第一版 AI 架構
~3 months首輪工程實測驗證
支援壓電、光子、III–V、寬能隙材料的單片與異質整合。
定義器件目標比較設計方向形成可製造需求
今日確認付款：當技術需求完整且可執行時，可於當日交付專業工程設計包。
一個專業 AI 路徑，覆蓋 MEMS 以外的功能器件
PMUT large arrays32–1,024+ elements · imaging · ultra-low-powerMetasurface & metalensWavelength · NA · aperture · efficiency · wavefrontPiezoelectric micromirrors1D/2D scanning · low voltage · compact optical enginesPhotonic PICSi₃N₄ · SOI · heterogeneous integrationCustom multi-material devicesFunction · interfaces · performance · manufacturable route
技術平台
涵蓋 MEMS、光子、超表面、化合物半導體與客製器件的開發與製造。
ENGINEERING · PILOT · VOLUME
PMUT 客製平台
Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.
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ENGINEERING · PILOT · VOLUME
壓電 MEMS 麥克風與微型揚聲器
Clear sound, wide bandwidth and compact piezoelectric acoustic devices.
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ENGINEERING · PILOT · VOLUME
壓電 MEMS 微鏡
Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.
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ENGINEERING · PILOT · VOLUME
SiC 平台
Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.
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ENGINEERING · PILOT · VOLUME
InP 平台
High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.
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ENGINEERING · PILOT · VOLUME
InAs / InGaAs 平台
Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.
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ENGINEERING · PILOT · VOLUME
PIC 光子積體平台
Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.
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ENGINEERING · PILOT · VOLUME
PIC + 壓電 / BTO 整合
PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.
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ENGINEERING · PILOT · VOLUME
超表面與超透鏡平台
Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.
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ENGINEERING · PILOT · VOLUME
GaN、GaAs、GeSn、鑽石與先進客製平台
Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.
查看平台 →接受試產 + 量產
從客製設計走向持續量產
所有支援平台可由 NRE、工程晶圓推進至試產、qualification 與持續晶圓級量產。
AI 設計 → 多材料單片整合 → 工程晶圓 → 實測驗證 → 試產 → 量產
AI DESIGN + DFM
Engineering wafer
Measured validation
Pilot + qualification
Recurring wafer supply
Volume manufacturing
Custom NRE → Production
從需求到製造
為 OEM、研究團隊與深科技公司提供清晰專案流程。
Define
Target function, frequency, aperture, geometry, interfaces and delivery format.
Engineer
Device architecture and process route are aligned with the target application.
Prototype
Engineering samples or wafers provide the first physical validation point.
Scale
Pilot and dedicated wafer routes support the transition toward repeatable supply.