PMUT · 126% MEASURED BANDWIDTH
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
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SWISS AI DESIGN · MULTI-MATERIAL MONOLITHIC INTEGRATION · VOLUME MANUFACTURING
AI-Designed Multi-Material Chips. Measured in ~3 Months. Ready to Scale.
25FAB co-optimizes device physics, geometry, material stacks and fabrication constraints, integrates multiple functional materials on a common wafer-level platform, and carries programs from AI architecture to measured engineering wafers, pilot lots and recurring volume production.
126%Measured PMUT bandwidth
69 dBMeasured acoustic output
20 MHz/VMeasured DC tuning
~3 monthsFirst engineering validation
AI co-design · Monolithic multi-material integration · Wafer-level scale-up
PMUT · OEM MODULE
PMUT OEM Module
Broadband piezoelectric ultrasound from custom array design to packaged OEM integration. 126% measured bandwidth on the demonstrated platform.
PIEZO-TUNABLE PIC · 20 MHz/V
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
PRODUCT MODULES · FIRST
Flagship product & system modules
Start with measured products. 25FAB puts PMUT, piezo-tunable PICs and the 69 dB piezo MEMS speaker first, with a dedicated module route for quantum systems.
PIEZO-TUNABLE PIC · 20 MHz/V MEASURED
Piezo-Tunable PIC Module
Integrated photonics with piezoelectric actuation, measured 20 MHz/V DC tuning near 1550 nm, and a route from die to packaged module.
Explore module →PIEZO MEMS SPEAKER · 69 dB MEASURED
Piezo MEMS Speaker Module
Wafer-level piezoelectric MEMS speaker with 69 dB measured acoustic output, available for custom, pilot and volume manufacturing programs.
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QUANTUM SYSTEMS · FEATURED
Quantum Photonics & Beam Control
A modular wafer-level route for neutral-atom optical control, quantum photonics and precision beam systems: piezo MEMS, metasurfaces and tunable PICs.
Explore quantum systems →MEASURED · NOT SIMULATED
Start a production programMeasured performance. Production-ready pathways.
Not simulation alone. 25FAB closes the loop from AI design to wafer fabrication, measured device results and scalable supply.
Broadband piezoelectric ultrasound platform · custom, pilot and volume programs accepted.
Wafer-level piezoelectric MEMS speaker · custom, pilot and volume manufacturing accepted.
Piezo-tunable PIC near 1550 nm · repeatable response under +10 V / −10 V actuation.
Selected programs: design freeze → wafer fabrication → measurement → design feedback.
MEASURED · NOT SIMULATED
PMUT · 126%
Broadband piezoelectric ultrasound platform · custom, pilot and volume programs accepted.
PILOT + VOLUME PROGRAMSMEASURED · NOT SIMULATED
Speaker · 69 dB
Wafer-level piezoelectric MEMS speaker · custom, pilot and volume manufacturing accepted.
PILOT + VOLUME PROGRAMS
MEASURED · NOT SIMULATED
Piezo-Tunable PIC · 20 MHz/V
Piezo-tunable PIC near 1550 nm · repeatable response under +10 V / −10 V actuation.
PILOT + VOLUME PROGRAMSBeyond MEMS: design any functional chip with 25FAB AI
Submit functional targets for MEMS, photonics, metasurfaces, compound semiconductors or custom devices. Our platform translates them into manufacturable architectures and multi-material integration routes.
≈3 minutesto first AI architecture
~3 monthsFirst engineering validation
Monolithic and heterogeneous integration across piezoelectric, photonic, III–V and wide-bandgap material systems.
Define device targetsCompare design directionsPrepare a manufacturable brief
Payment confirmed today: professional engineering design package today — once the brief is complete and actionable.
One professional AI route for functional devices beyond MEMS
PMUT large arrays32 to 1,024+ elements · imaging · ultra-low-power integrationMetasurface & metalensWavelength, NA, aperture, efficiency and custom wavefrontPiezoelectric micromirrors1D/2D scanning · low voltage · compact optical enginesPhotonic PICSi₃N₄, SOI and heterogeneous integration · layout to waferCustom multi-material devicesDefine the function, interfaces and performance — we engineer the route
Physics-guided inverse-design cases
Materials & wafer foundry
One multi-material manufacturing route
25FAB supports project-specific design and wafer processing across piezoelectric, photonic, III–V, wide-bandgap and heterogeneous material systems.
Standard / established routes
Piezoelectric / electro-optic
Standard / established routes
Photonics / silicon
Standard / established routes
III–V semiconductors
Standard / established routes
Wide-bandgap / advanced
Standard / established routes
Heterogeneous integration
Project-specific feasibility route
Engineering feasibility
Technology platforms
Specialist manufacturing and development routes for MEMS, photonics and compound-semiconductor devices.
ENGINEERING · PILOT · VOLUME
PMUT Custom Platforms
Industrial PMUT chips and arrays aligned to 1–5, 2–6, 3–10, 4–13, 5–15, 8–20 and 1–15 MHz OEM architectures.
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ENGINEERING · PILOT · VOLUME
Piezoelectric MEMS Microphones & Speakers
Clear sound, wide bandwidth and compact piezoelectric acoustic devices.
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ENGINEERING · PILOT · VOLUME
Piezoelectric MEMS Micromirrors
Fast, precise beam steering and optical scanning with low-voltage piezoelectric actuation.
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ENGINEERING · PILOT · VOLUME
SiC Platforms
Rugged semiconductor and MEMS platforms for high-power, harsh-environment and advanced sensing applications.
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ENGINEERING · PILOT · VOLUME
InP Platforms
High-speed photonic and optoelectronic platforms for communication, sensing and integrated light sources.
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ENGINEERING · PILOT · VOLUME
InAs / InGaAs Platforms
Advanced III–V materials for infrared detection, sensing and integrated optoelectronics.
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ENGINEERING · PILOT · VOLUME
PIC Platforms
Integrated photonic circuits and wafer-level manufacturing for scalable optical systems.
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ENGINEERING · PILOT · VOLUME
PIC + Piezo / BTO Integration
PIC integration with PZT, AlN, AlScN, BTO-on-Si and other electro-optic / piezoelectric functional films.
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ENGINEERING · PILOT · VOLUME
Metasurface & Metalens Platforms
Custom flat-optics, metalens and metasurface devices for beam shaping, focusing, sensing and 3D imaging.
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ENGINEERING · PILOT · VOLUME
GaN, GaAs, GeSn, Diamond & Advanced Custom Platforms
Project-specific semiconductor and heterogeneous-integration routes for GaN, GaAs, Ge-on-Si, GeSn, diamond and non-standard material stacks.
View Platform →PILOT + VOLUME PROGRAMS
From custom design to recurring volume production
Every supported 25FAB platform can be engaged from custom NRE and engineering wafers through pilot, qualification and recurring production, subject to process qualification and customer specifications.
AI design → multi-material integration → engineering wafer → measured validation → pilot → volume production
AI DESIGN + DFM
Engineering wafer
Measured validation
Pilot + qualification
Recurring wafer supply
Volume manufacturing
Custom NRE → Production
A simple route from requirement to manufacturing
Clear project stages help OEM and deep-tech teams understand how to start and how a program can scale.
Define
Target function, frequency, aperture, geometry, interfaces and delivery format.
Engineer
Device architecture and process route are aligned with the target application.
Prototype
Engineering samples or wafers provide the first physical validation point.
Scale
Pilot and dedicated wafer routes support the transition toward repeatable supply.
Discuss a project
AI co-design, multi-material monolithic integration, measured device performance and a direct path from engineering wafers to pilot and volume manufacturing.